LX Semicon's Electronic Ceramic Substrate uses SMB technology differentiated from conventional bonding, so that we provide silicon nitride (Si3N4) ceramic substrates that support high strength and high heat dissipation performance and aluminum nitride (AlN) ceramic substrates optimized for heat dissipation. ※ SMB : Sputtering Metal Bonding
High-performance ceramic substrate for heat dissipation suitable for electric vehicles
With the increasing demand and performance improvement of electric vehicles, there is a growing need for high-performance ceramic substrate for heat dissipation suitable for electric vehicles. Ceramic substrate for heat dissipation for electric vehicles requires high heat dissipation performance, high bending strength performance, and careful thickness management during module assembly.
LX Semicon’s ceramic substrate for heat dissipation with SMB technology provides high thermal and mechanical reliability, securing the excellent characteristics of substrates for heat dissipation.
Coating the surface of the ceramic substrate with a metal layer, followed by joining to a copper
substrate using a hot press process.
Joining of copper substrate to ceramic
substrate surface by screen-printed paste
and heat treatment.
High thermal and mechanical reliability
LX Semicon’s ceramic substrate for heat dissipation, which incorporates SMB technology, allows for void-free joining of the thin and uniform joining surfaces of ceramic and copper substrates. This provides high bending strength and dimensional accuracy, resulting in high thermal and mechanical reliability.
In addition, it enables the combination of various thicknesses of copper in an asymmetric manner.
SMB Applicable Fields
Power Supply Unit