The next wave, we design

Heat Dissipation

Metalized Ceramic Substrate

The Metalized Ceramic Substrate is a heat dissipation substrate that joins the ceramic and metallic sections.
As it features the excellent heat dissipation performance and mechanical strength, this substrate is used for radiation of heat or
parts that involve high-voltage/high-current operation resulting in intense heat generation.

heatimg heatimg

Metalized Ceramic Substrate

heatimg

※ This image is for description. It may be different from the actual appearance.

Application

The connecting layer is thin but sound and uniform.

LX Semicon forms a thin but sound and uniform connecting layer of ceramic and metallic (copper) sections by applying the MDB (Metal Diffusion Bonding) method.
Since thermal shock is applied only in the horizontal direction, it is not easily detached. This product is highly resistant to warpage.
Besides, the electric characteristics are also outstanding since no such metal as Ag (silver) is used for joint connection

Connecting process (Metal Diffusion Bonding)
heatimg heatimg heatimg
Uniform bonding interface
heatimg heatimg