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Heat Dissipation

Heat Dissipation Material

LX Semicon uses AlN and Si₃N₄ ceramic materials of outstanding properties.
AlN features the excellent heat radiation performance while Si₃N₄ features the outstanding mechanical strength.
By combining these two elements, it is possible to manufacture customized products that satisfy each customer's specific needs.
In combination with copper, the optimal heat radiation performance and mechanical reliability are secured.
An asymmetric combination with copper is also possible.

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Ceramic

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Cu

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1

Ceramic

(Information on ceramics used by LX Semicon)

Ceramic Type AlN (Aluminum nitride) Si₃N₄ (Silicon nitride)
Thickness 0.38/0.635 0.25/0.32
Thermal Conductivity ≥ 170 W/m.K ≥ 80 W/m.K
Bending Strength ≥ 400Mpa ≥ 700Mpa
CTE 4.6 x 10-6/℃ 2.6 x 10-6/℃

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Cu

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